A3P250-FGG256
| Part No | A3P250-FGG256 |
|---|---|
| Manufacturer | Microsemi |
| Description | IC FPGA 157 I/O 256FBGA |
| Datasheet | Download Datasheet |
| ECAD Module |
|
Spot quantity:
18966
Pricing
| QTY | UNIT PRICE | EXT PRICE |
|---|---|---|
| 1 | 25.63 | |
| 10 | 25.1174 | |
| 100 | 24.3485 | |
| 1000 | 23.5796 | |
| 10000 | 22.5544 |
Specification
MountSurface Mount
Width17mm
Height1.2mm
Length17mm
SeriesProASIC3
RAM Size4.5kB
Frequency231MHz
Lead FreeLead Free
PackagingTray
Published2013
Memory Size4.5kB
Part StatusActive
RoHS StatusRoHS Compliant
Max Frequency231MHz
Mounting TypeSurface Mount
Number of I/O157
Number of Pins256
Package / Case256-LBGA
Total RAM Bits36864
Contact PlatingCopper, Silver, Tin
Number of Gates250000
Base Part NumberA3P250
Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
Voltage - Supply1.425V~1.575V
Factory Lead Time7 Weeks
Max Supply Voltage1.575V
Min Supply Voltage1.425V
Number of Registers6144
Radiation HardeningNo
Operating Temperature0°C~85°C TJ
Supplier Device Package256-FPBGA (17x17)
Operating Supply Current3mA
Operating Supply Voltage1.5V
Max Operating Temperature70°C
Min Operating Temperature0°C
Number of Logic Elements/Cells3000
Moisture Sensitivity Level (MSL)3 (168 Hours)
